TSL202R【PDF 12/13 页】IC LINEAR SENSOR ARRAY 128X1

TSL202R

128 y 1 LINEAR SENSOR ARRAY

TAOS032F JANUARY 2012

The LUMENOLOGY r Company

www.taosinc.com

SOLDERING INFORMATION

TSL202 128 y 1 linear array 14-lead gold pin package soldering instructions:

D The TSL202R has been designed to withstand a lead temperature during soldering of 260?/SPAN>C for 10 seconds

at a distance of 1.6 mm from the package body.

D In most applications, these through-hole parts will be sufficiently protected by the combination of the PCB

or flex plus the standoff provided by the package.

D If lead clipping is required, this should be performed after solder attach to prevent the pulling of the lead from

the package body.

D As in all board manufacturing, care should be taken to prevent part bending during board singulation or final

assembly.

D If the process includes both surface-mount parts and the TSL202R, the surface mount operations should

be completed first with the through-hole parts afterward.

These parts can be washed as a part of the flux cleanup operation. A final top-surface cleanup may be required

with water or alcohol to remove any remaining particles.

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